| 摘要 |
PROBLEM TO BE SOLVED: To provide a pressing plate capable of fixing a plurality of semiconductor elements placed on an inspection jig using a simple structure, and to provide a semiconductor inspection device that uses the same. SOLUTION: The semiconductor element 1, placed on the inspection jig 50, is pressed and fixed to the inspection jig 50, by using the pressing plate 22 in which a plurality of pressing parts 30 are formed on a plate body 23 and in which support pieces 32 abutting against the semiconductor element 1 are formed on the pressing parts 30 by means of opening parts 26, bored in the plate body 23 and cutout parts 28 bored in the plate body 23 and in communication with the opening parts 26. The electrical characteristics of the semiconductor element 1 are inspected by making the semiconductor element 1 drive by a drive part 11. COPYRIGHT: (C)2010,JPO&INPIT
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