| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component device which does not generate a gap at a joining part between an insulated wire and a resin material even under the environment of larger temperature change, and also to provide a method of manufacturing the same electronic component device. SOLUTION: The electronic component device includes an electronic component such as a thermistor element 1, an insulated wire 3 connected to this electronic component, and a thermosetting resin material 6 covering a part of the thermistor element 1 and the insulated wire 3. A tightening material 5 is provided to tighten an insulated part 3b of the insulated wire 3 from the entire part of external circumference and the thermistor element 1 and a part of the insulated wire 3 connected to the thermistor element 1 are covered with the thermosetting resin material 6 under the condition of including this tightening material 5. Thereby, since the tightening material 5 is arranged to the external circumference of the insulated wire 3 under the condition to tighten the insulated part 3b of the insulated wire 3 from the entire part of the external circumference, namely the condition to apply the tightening force, any gap is never generated at the joining part between the insulated wire 3 and the tightening material 5 even under the environment of large temperature change. COPYRIGHT: (C)2010,JPO&INPIT
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