| 摘要 |
Disclosed is a method for placing an electronic element on an electrode formed on a substrate to electrically connect the electronic element to the electrode. The method comprises: a preliminary step of providing a substrate (101) having, formed on a surface thereof, hydrophilic areas (102) each of which is surrounded by a water repellent area (103) and has a hydrophilic electrode disposed therein; step 1 of coating an electroless plating liquid (105) comprising a metal compound dispersed in water on the substrate (101) to place an electroless plating liquid (106) on the hydrophilic areas (102); step 2 of coating an electronic element dispersion (109) comprising an electronic element (110) with an element electrode dispersed in a first liquid (111) on the substrate (101) to allow the electronic element (110) to migrate from the first liquid (111) to the electroless plating liquid (106) and thus to allow the hydrophilic electrode to come into contact with the element electrode; step 3 of covering the surface of the substrate (101) with a second liquid (114) before the water contained in the electroless plating liquid (106) entirely disappears due to volatilization, and causing a plating reaction between the hydrophilic electrode and the element electrode, thereby electrically connecting the hydrophilic electrode to the element electrode; and step 4 of removing the second liquid (114) from the substrate (101). |
