| 摘要 |
A LED heat dissipation structure includes a heat sink having a base block and radiation fins, LED devices bonded to the flat top wall of the base block of the heat sink with a thermal compound and a substrate, which is affixed to the base block of the heat sink above the LED devices with screws to hold down the LED devices, having a circuit layer located on the bottom wall thereof and electrically connected with the LED devices to provide the necessary working power supply and a plurality of through holes that accommodate epoxy lenses of the LED devices. |
