Electronic component i.e. power semiconductor component, cooling arrangement, has conductor plates arranged at mounting body, where to-be-cooled electronic components electrically contact contacting connector or component of plates

摘要

The arrangement (10) has coolant chambers (19, 20) formed between a mounting body (11) and to-be cooled electronic components (12, 13) such that coolant is directly led to the to-be cooled electronic components. Conductor plates (14-17) are arranged at the mounting body, and the to-be-cooled electronic component contacts a contacting connector or a component of the conductor plates. The mounting body is symmetrically formed with respect to a middle plane (18). A flow chamber (21) is provided for the coolant at the mounting body.