| 摘要 |
<P>PROBLEM TO BE SOLVED: To manufacture a semiconductor device, low in cost and capable of insuring reliability. <P>SOLUTION: A plurality of semiconductor devices are formed on a substrate 17 through a mounting process for mounting a bare chip 11 having semiconductor elements on a substrate 17 having electrode terminals 14; a connecting process for electrically connecting electrode pads 13 formed on the bare chip 11, to the electrode terminals 14 through wires 15; and a coating process for coating a resin 16 by dispense method, so that at least the electrode pads 13 and the wires 15 are covered by the resin 16. Then the semiconductor devices are divided by cutting through a dicing process. <P>COPYRIGHT: (C)2007,JPO&INPIT |
