One embodiment of an electronic component packaging system includes a base adapted for supporting an electronic component, a lid sealed to the base, the lid including a fillport, and the fillport hermetically sealed by light irradiation.
申请公布号
US7728425(B2)
申请公布日期
2010.06.01
申请号
US20050157350
申请日期
2005.06.21
申请人
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
发明人
ADDINGTON CARY G.;WHITTINGTON SHELL ELAINE;MARDILOVICH PETER;WREN WILLIAM
