发明名称 |
Micro camera module and method of manufacturing the same |
摘要 |
A semiconductor chip constituting an image pickup device is provided on a substrate and includes a connection terminal and an image pickup portion. A lens sheet having a lens portion is provided on the semiconductor chip. A groove is formed in at least the substrate to expose the connection terminal. A conductor pattern is formed in the groove and has one end electrically connected to the connection terminal.
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申请公布号 |
US7728398(B2) |
申请公布日期 |
2010.06.01 |
申请号 |
US20060476160 |
申请日期 |
2006.06.28 |
申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
NAKAJO HIRONORI;YOSHIKAWA HIROSHI;SASAKI MICHIO;HORI AKIHIRO |
分类号 |
H01L31/058;H01L23/12;H01L27/14;H04N5/225;H04N5/335;H04N5/369 |
主分类号 |
H01L31/058 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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