发明名称 High etch resistant underlayer compositions for multilayer lithographic processes
摘要 An etch resistant thermally curable Underlayer for use in a multiplayer liyhographic process to produce a photolithographic bilayer coated substrate, the composition having: (a) at least one cycloolefin polymer comprising at least one repeating unit of Structure (I), and at least one repeating unit of Structure (II), and optionally at least one repeating unit of Structure (III) with the proviso that neither Structure (I) nor Structure (II) nor Structure (III) contains acid sensitive groups. b) at least one cross-linking agent selected from the group consisting of an amino or phenolic cross-linking agent; c) a least one thermal acid generator (TAG); d) at lest one solvent; and e) optionally, at least one surfactant.
申请公布号 US7727705(B2) 申请公布日期 2010.06.01
申请号 US20080033915 申请日期 2008.02.20
申请人 FUJIFILM ELECTRONIC MATERIALS, U.S.A., INC. 发明人 DE BINOD B.;MALIK SANJAY;SAKAMURI RAJ;HONG CHISUN
分类号 G03F7/09;G03C1/76;G03F7/20;G03F7/30;G03F7/36 主分类号 G03F7/09
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