| 摘要 |
A non-destructive test structure for printed circuit board characterization and method of testing the same are disclosed. In one form, a method for testing a printed circuit board can include applying a test signal to a first test location of a first test structure associated with a first inner bus layer of a printed circuit board. The method can also include measuring a crosstalk voltage at a second test location operably associated with the first test structure. The method can further include comparing the crosstalk voltage to a crosstalk specification of the printed circuit, board.
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