| 摘要 |
In a method for forming a fine pattern, a target layer to be patterned is formed on a semiconductor substrate and a polysilicon layer is formed on the target layer. A partition is then formed on the polysilicon layer with an amorphous carbon layer pattern. A spacer is attached to a sidewall of the partition. Thereafter, the spacer is divided into bar patterns by selectively removing the partition. A polysilicon layer pattern is formed by selectively etching a portion of the poly silicon layer exposed by the divided bar patterns and then a target layer pattern is formed by selectively etching a portion of the target layer exposed by the polysilicon layer pattern.
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