发明名称 |
Radiation-emitting component provided with metallic injected-molded carrier |
摘要 |
A process is specified for producing a radiation-emitting component comprising a housing body and a carrier for a radiation-emitting semiconductor body, in which the carrier is produced in an injection molding process from a molding compound containing a metal.
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申请公布号 |
US7728507(B2) |
申请公布日期 |
2010.06.01 |
申请号 |
US20060518401 |
申请日期 |
2006.09.08 |
申请人 |
OSRAM OPTO SEMICONDUCTORS GMBH |
发明人 |
WINTER MATTHIAS;JAEGER HARALD |
分类号 |
H01L23/495;H01L33/48;H01L33/62;H01L33/64 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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