发明名称 |
Apparatus and method for arranging devices for processing |
摘要 |
An apparatus is provided for arranging for processing a semiconductor device having surface components on its surface. A device support comprising a set of protrusions for contacting a surface of the semiconductor device supports the semiconductor device on a plane. The protrusions are arranged and positioned such that they avoid contact with the surface components on the surface. In order to grip the semiconductor device supported on the plane, a clamping device having a first set of clamps is configured for gripping the semiconductor device along a first axis and a second set of clamps is configured for gripping the semiconductor device along a second axis perpendicular to the first axis.
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申请公布号 |
US7726540(B2) |
申请公布日期 |
2010.06.01 |
申请号 |
US20050301064 |
申请日期 |
2005.12.12 |
申请人 |
ASM ASSEMBLY AUTOMATION LTD. |
发明人 |
CHENG CHI WAH;TANG HOI SHUEN JOSEPH;MAK TIM WAI TONY;CHAN SEE LOK |
分类号 |
B23K1/14;B23K5/22;H01R43/00 |
主分类号 |
B23K1/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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