发明名称 MANUFACTURING METHOD OF CONDUCTIVE MOLD PRODUCT, CONDUCTIVE MOLD PRODUCT, AND SILVER PASTE USED FOR THE SAME
摘要 PROBLEM TO BE SOLVED: To enable to obtain a mold product made of a structure containing silver nanoparticle constituent and an organic constituent adhered in a simple method, a conductive mold product showing high conductivity at low-temperature firing at 150°C or below, a method of manufacturing the same, and silver paste capable of low-temperature sintering used for the same. SOLUTION: The silver paste contains: an aqueous dispersant of a silver-content structure mainly composed of a kind or more compounds (X) selected from a group consisting of a compound (x1) made of polyethylene imine combined with polyethylene glycol, a compound (x2) made of polyethylene imine combined with linear epoxy resin (c), and a compound (x3) made of polyethylene imine combined with polyethylene glycol and linear epoxy resin, and silver nanoparticles (Y); and a compound (Z) including a functional group capable of reacting with nitrogen atoms of the polyethylene imine in the compound (X), wherein the silver paste includes a melting point in a dry state of 100 to 150°C, and the conductive mold product uses the same. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010118168(A) 申请公布日期 2010.05.27
申请号 JP20080288651 申请日期 2008.11.11
申请人 DIC CORP 发明人 KAWAMURA KAORI;KIN JINKA;RI SHIYOUTAKU;MATSUKI KOICHIRO;TAKAHASHI AKIO
分类号 H01B13/00;C08G73/04;C08G81/00;C08J7/04;H01B1/22;H01B5/14 主分类号 H01B13/00
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