PROCESS FOR CREATING HOLE IN POLYMERIC SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide a new method for developing new dielectric materials, and operating and processing the materials. SOLUTION: A curable film without substantially including voids is used in a process for manufacturing a via on a substrate. The curable film contains (a) one or more active hydrogen-containing resin and (b) a curable composition containing one curing reagent reactive with the active hydrogen of (a). The process includes steps of: (a) partially curing the curable film at an ambient temperature; (b) applying a resist onto the curable film; (c) imaging the resist in predetermined locations; (d) developing the resist to expose predetermined areas of the curable film; (e) removing the exposed areas to form holes through the film; and (f) heating the curable film to a temperature and for a time sufficient to complete the curing of the curable composition. COPYRIGHT: (C)2010,JPO&INPIT