| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive composition for printing to give a B-stage resin having adhesiveness by which misregistration of a laminated chip can be reduced in an encapsulating process. SOLUTION: The adhesive composition comprises a thermosetting resin with a weight-average molecular weight of less than 15,000, a curing accelerator, and a high molecular weight component with a weight-average molecular weight of 15,000 or more. The content of the high molecular weight component is 10 pts.mass or more and less than 60 pts.mass based on 100 pts.mass of the thermosetting resin. COPYRIGHT: (C)2010,JPO&INPIT
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