| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an image sensor in which an image chip and a logic chip are integrated in three dimensions using one pad. Ž<P>SOLUTION: The image sensor includes: a first interlayer insulation layer having first metal wiring formed thereon; a bonding silicon formed on the first interlayer insulation layer and including a first impurity region and a second impurity region; a second interlayer insulation layer formed on the bonding silicon; a first contact plug connected to the first metal wiring through the bonding silicon; a third interlayer insulation layer formed on the second interlayer insulation layer; a second contact plug connected to the first impurity region through the third interlayer insulation layer; and second metal wiring formed on the second interlayer insulation layer and connected to the second contact plug. The image sensor includes a color filter layer and a microlens formed over the second metal wiring. An insulation layer for isolation is formed between the first contact plug and the first impurity region. A part of the insulation layer is formed on the second interlayer insulation layer. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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