发明名称 |
TRANSFER FILM AND METHOD FOR FABRICATING A CIRCUIT |
摘要 |
A method of fabricating a circuit includes bonding an electrically conductive layer to a donor film, removing selected portions of the electrically conductive layer from the donor film to provide a circuit arrangement, and transferring the circuit arrangement from the donor film to a substrate.
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申请公布号 |
US2010126958(A1) |
申请公布日期 |
2010.05.27 |
申请号 |
US20080277391 |
申请日期 |
2008.11.25 |
申请人 |
ATTRIDGE PAUL;LAMM FOSTER P |
发明人 |
ATTRIDGE PAUL;LAMM FOSTER P. |
分类号 |
H01B13/00;C23F1/02 |
主分类号 |
H01B13/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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