发明名称 TRANSFER FILM AND METHOD FOR FABRICATING A CIRCUIT
摘要 A method of fabricating a circuit includes bonding an electrically conductive layer to a donor film, removing selected portions of the electrically conductive layer from the donor film to provide a circuit arrangement, and transferring the circuit arrangement from the donor film to a substrate.
申请公布号 US2010126958(A1) 申请公布日期 2010.05.27
申请号 US20080277391 申请日期 2008.11.25
申请人 ATTRIDGE PAUL;LAMM FOSTER P 发明人 ATTRIDGE PAUL;LAMM FOSTER P.
分类号 H01B13/00;C23F1/02 主分类号 H01B13/00
代理机构 代理人
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