| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a connector structure without risk of soldering crack in a lead suitable for a housing of a connector or of displacement of a lead, even if warp is generated at a substrate where the connector is mounted. <P>SOLUTION: The structure is provided with a housing 2 on which a lead 5 is reflow-soldered to a substrate at one end side opposed to the substrate 3. The housing 2 has a plurality of housing parts 2a, 2b, 2c at the other end side opposite to the substrate 3, and each of the plurality of housing parts 2a, 2b, 2c is soldered and fixed to the other adjacent one by low-melting-point solder 8. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
