发明名称 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING SILICA-BASED FILM, AND DEVICE AND MEMBER INCLUDING SILICA-BASED FILM
摘要 <P>PROBLEM TO BE SOLVED: To provide: a photosensitive resin composition having excellent coating property and sufficiently high basic performances as a photosensitive interlayer dielectric material, such as photosensitive characteristic; a method for forming a silica-based film using the composition; and a semiconductor device, a flat panel display device and a member for an electronic device including a silica-based film formed by the method. <P>SOLUTION: The photosensitive resin composition includes (a) a siloxane resin obtained by hydrolytic condensation of a silane compound including a compound represented by general formula (1), (b) a solvent in which the component (a) dissolves, (c) an ester compound of phenols or alcohols and a naphthoquinone diazide sulfonic acid, and (d) a surfactant, wherein, in formula (1), R<SP>1</SP>denotes an organic group; A denotes a divalent organic group; X denotes a hydrolyzable group and a plurality of symbols X within the same molecule may be the same or different. <P>COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010117696(A) 申请公布日期 2010.05.27
申请号 JP20090035341 申请日期 2009.02.18
申请人 HITACHI CHEM CO LTD 发明人 ABE KOICHI;KASUYA KEI;AOKI YOSUKE
分类号 G03F7/075;C08G77/14;G03F7/004;G03F7/023;G03F7/40;H01L21/027 主分类号 G03F7/075
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