| 摘要 |
PROBLEM TO BE SOLVED: To provide a re-releasable process film, which has a base material film and a pressure-sensitive adhesive layer arranged on its one side, more specially, when the film is used as the base material sheet for producing a flexible printed wiring board applied to a multilayer printed wiring board, to provide a re-releasable process film which, on removal, is prevented from being fouled at the side of the base material sheet as an adherend while sufficiently increasing adhesion between an adhesive sheet and the base material sheet, or, when the film is applied to a glass part of a CCD or CMOS, to provide a highly heat-resistant re-releasable process film little causing residual adhesive on the adherend and deformation of the base material film even by exposure to high temperature around 260°C. SOLUTION: The re-releasable process film comprises the base material film and the pressure-sensitive adhesive layer formed on one side of the base material film. The pressure-sensitive adhesive layer is formed by using an adhesive comprising an acrylic copolymer (A) having a specific ratio of specific monomer units, and an isocyanate crosslinking agent (B). In the acrylic copolymer, the weight-average molecular weight (Mw) is 300,000-1,000,000; and the molecular-weight distribution (weight-average molecular weight Mw/number-average molecular weight Mn) is 3.0 or lower. COPYRIGHT: (C)2010,JPO&INPIT |
