| 摘要 |
PROBLEM TO BE SOLVED: To provide a testing method capable of reducing production cost, a testing device and a method for producing a semiconductor device having the testing method. SOLUTION: Electrical characteristics are tested by supporting the back surface of a semiconductor element 11 with a supporting part 16 having a distorted surface, bringing a large number of probes (contact pins 12 in Fig.2) into press-contact with the surface having electrodes disposed thereon of the semiconductor element 11, and distorting the shape of the distorted surface of the semiconductor element 11. This method makes it possible to determine whether to assemble a semiconductor device using the semiconductor element 11 based on the testing result of the electric characteristics of the distorted semiconductor element 11, and to reduce production cost of the semiconductor device. COPYRIGHT: (C)2010,JPO&INPIT
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