| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer polyimide film suitable for a flexible printed-wiring board or the like, which has high flexibility and dimensional stability. SOLUTION: The polyimide film has a multilayer structure containing a core layer and cladding layer exposed to both sides of the film. The core layer is non-thermoplastic polyimide in which average elastic modulus is 4.0-10.0 GPa, and the cladding layer is non-thermoplastic polyimide in which peel strength is≤3 N/cm. Average elastic modulus (a) of the core layer and average elastic modulus (b) of the cladding layer satisfy following formula (1): a>b. COPYRIGHT: (C)2010,JPO&INPIT
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