| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a printed wiring board which can control connection resistance between a metal substrate and a conductive layer, and can be simplified in manufacturing, and its manufacturing method. Ž<P>SOLUTION: The printed wiring board 1 includes the metal substrate 2, an insulating layer 3 formed on the surface of the metal substrate 2, the conductive layer 4 formed on the surface of the insulating layer 3, and a bottomed through-hole 5 formed on the insulating layer 3 and the conductive layer 4 in which the metal substrate 2 is a bottom surface and the insulating layer 3 and the conductive layer 4 are wall surfaces wherein the metal substrate 2 and the conductive layer 4 are electrically connected using the through-hole 5. Then, on the surface of the metal substrate 2 which is the bottom surface of the through-hole 5, a dried matter of conductive ink 6 including metal particulates (that is, residue obtained by evaporating and drying the conductive ink 6) is provided. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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