| 摘要 |
<P>PROBLEM TO BE SOLVED: To make the equipment compact while maintaining high processing accuracy. Ž<P>SOLUTION: The wiring board repair equipment 20 can destroy a short circuit portion SH appropriately with comparatively compact configuration similarly to a case where a general picosecond laser or femtosecond laser is used, by supplying a pulsating laser drive signal SD from the laser control section 2 of a compact short pulse light source device 1 to a semiconductor laser 3, outputting unique peak light LEP from the semiconductor laser 3 and irradiating the short circuit portion SH formed on the wiring material 100W of the wiring board 100 with the unique peak light LEP while condensing. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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