发明名称 |
BONDING PAD STRUCTURE FOR BACK ILLUMINATED OPTOELECTRONIC DEVICE AND FABRICATING METHOD THEREOF |
摘要 |
A bonding pad structure for an optoelectronic device. The bonding pad structure comprises a carrier substrate having a bonding pad region and an optoelectronic device region. An insulating layer is disposed on the carrier substrate, having an opening corresponding to the bonding pad region. A bonding pad is embedded in the insulating layer under the opening to expose the top surface thereof. A device substrate is disposed on the insulating layer corresponding to the optoelectronic device region. A cap layer covers the device substrate and the insulating layer excluding the opening. A conductive buffer layer is disposed in the opening to directly contact the bonding pad. The invention also discloses a method for fabricating the same. |
申请公布号 |
US2010127408(A1) |
申请公布日期 |
2010.05.27 |
申请号 |
US20100695792 |
申请日期 |
2010.01.28 |
申请人 |
VISERA TECHNOLOGIES COMPANY LIMITED |
发明人 |
WANG KAI-CHIH;LIU FANG-CHANG |
分类号 |
H01L23/488;H01L21/60 |
主分类号 |
H01L23/488 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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