| 摘要 |
The present invention relates to an LED package substrate that includes a substrate of high heat radiation comprising a heat radiation plate, an insulation skin layer that is formed on top of said heat radiation plate, a circuit wiring pattern layer that is formed over said insulation skin layer, and at least one LED chip that is directly mounted on said circuit wiring pattern layer. The present invention, thus configured, has the effect of enabling the formation of an insulation skin layer with good insulation performance and low thickness. As a result, it has the effect of improving heat radiation efficiency. In addition, the present invention has the effect of enabling the formation of a thinner circuit wiring pattern by forming a thinner conduction layer over said insulation skin layer using a vapor deposition method and by forming a circuit wiring pattern layer using an etching method, and thus has the effect of improving the efficiency of heat radiation. |
