发明名称 |
Method for electrical contacting during application of electronic components on substrate, involves holding electronic components with associated contact areas on support material |
摘要 |
<p>The method involves holding electronic components with associated contact areas on support material. The support material is supplied to a substrate, where the electronic components are guided under pressure to run electronic components on substrate conveyor. An independent claim is included for a device for execution of electrical contacting method.</p> |
申请公布号 |
DE102009022299(A1) |
申请公布日期 |
2010.05.27 |
申请号 |
DE20091022299 |
申请日期 |
2009.05.22 |
申请人 |
TECHNISCHE UNIVERSITAET CHEMNITZ |
发明人 |
WALTHER, THOMAS;DINTER, MAIK;BAUMANN, REINHARD ROLAND |
分类号 |
H01L21/58;H05K3/32 |
主分类号 |
H01L21/58 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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