METHOD FOR DEPOSITING THIN FILM ON WAFER

摘要

PURPOSE: A method for depositing a thin film is provided to reduce manufacturing and maintenance costs of a thin film depositing device by not requiring a valve to spray gas. CONSTITUTION: A plurality of substrates is received on a substrate receiving unit(S310). A reduction layer is formed on the substrate by supplying a reducer through a reduction gas supply unit while rotating a gas spray unit around a substrate support unit so that the plurality of substrates successively passes the lower side of the reduction gas supply unit(S320). A thin film is formed on the substrate by supplying a precursor, the reaction gas, the reducer, and purge gas through the gas supply unit while rotating the gas spray unit around the substrate support unit sot that the substrate with the reduction layer passes the lower side of the reaction gas supply unit, a raw gas supply unit, and the reduction gas supply unit successively(S330).