| 摘要 |
PURPOSE: A communication module is provided to minimize a module size by improving spacing efficiency of an impedance matching device. CONSTITUTION: A ground pattern is formed on a substrate. An impedance matching unit(110) is formed on the exposed substrate in which the part of the ground pattern is etched. The impedance matching unit comprises a strip line and a via(112). The strip line has preset impedance. The via connects the impedance matching target circuit device with the strip line.
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