| 摘要 |
PURPOSE: A wafer rotating plate for an ultra thin film wafer is provided to improve a process property of a wafer with low flatness and to prevent damage to the wafer by uniformly fixing the wafer with the uniform vacuum of a micro-porous vacuum chuck. CONSTITUTION: A rotating plate uses a vacuum chuck made of a micro-porous material. A constant buffer space is formed to make a uniform vacuum in the end of a vacuum line. A structure with a grid shape is installed on the constant buffer space of the upper side of the vacuum line. A nitrogen supply tube(6) supplies the vacuum and the nitrogen gas for fixing the wafer. A nitrogen jet plate(7) uniformly jets the nitrogen to the end of the nitrogen tube.
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