发明名称 GLASS SUBSTRATE CUTTING DEVICE AND GLASS SUBSTRATE CUTTING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a glass substrate cutting method which prevents an uncut part from being formed in a cut end part in the cutting of the glass substrate by heating and cooling. SOLUTION: The glass substrate cutting method includes: a groove-forming step of forming a cut starting groove on the starting edge of a cut scheduled line on the surface of the glass substrate and a cut ending groove on the termination of the cut scheduled line; and a crack line forming step of forming a crack line formed by extending the crack produced in the thickness direction of the glass substrate from the starting to the ending of the cut scheduled line by locally heating and cooling the glass substrate while scanning the surface of the glass substrate. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010116272(A) 申请公布日期 2010.05.27
申请号 JP20080288625 申请日期 2008.11.11
申请人 SHARP CORP 发明人 YAMAZAKI MASAHIKO;KAMISOYAMA HIROSHI
分类号 C03B33/023;B23K26/14;B23K26/38;B28D1/24;B28D5/00;C03B33/09;G02F1/13;G02F1/1333 主分类号 C03B33/023
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