| 摘要 |
PROBLEM TO BE SOLVED: To prevent an occurrence of a stress concentration at the peripheral border of a substrate of a bonding apparatus. SOLUTION: A substrate holding member includes: a plate-like member with a holding surface in contact with a substrate to hold the substrate; and a pressure receiving member arranged along the outer circumference of the holding region for holding the substrate at the holding surface and projected from the holding surface. The plate-like member may further has a flange extending to the outside of the pressure receiving member at the holding surface. An amount of projection of the pressure receiving member may be equal to the thickness of the substrate held in the holding region. The pressure receiving member may be an annular member surrounding the holding region. COPYRIGHT: (C)2010,JPO&INPIT |
