| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent a yield, or the like from deteriorating because of adhesion of particles to semiconductor wafers, cracks of semiconductor wafers, or the like, namely a harmful influence when conveying the semiconductor wafers horizontal to a floor surface by laying the semiconductor wafers on their sides, and to provide a conveyance mechanism and a conveyance method of semiconductor wafers optimum for a vertical semiconductor wafer manufacturing apparatus having a small footprint. Ž<P>SOLUTION: The conveyance mechanism 1 of the semiconductor wafer 5 includes: a first circular-arc arm 2; a second arm 6 where both the sides of the tip are in a circular-arc shape and the entire part is in a rod shape; and a cassette 4 placed on a circumference identical to the circular arc of the first arm 2. The first arm 2 pushes out the semiconductor wafer 5 in the cassette 4 to an upper portion of the cassette 4 by rotation of the first arm 2, and supports the semiconductor wafer 5 on a floor surface 50 in a vertical state along with the second arm 6 rotating in the opposite direction. Then, both the arms are rotated in a rotary direction of the first arm 2, convey the semiconductor wafer 5 to a stop position 19 at an upper position of a rotary shaft 7, and also convey the wafer in the opposite direction. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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