发明名称 |
LEAD FRAME, METHOD FOR MANUFACTURING THE SAME AND SEMICONDUCTOR DEVICE |
摘要 |
A lead frame includes a lead frame body 21 having a die pad 24 to which a semiconductor chip 12 is bonded and a plurality of leads 25 arranged around the die pad 24 and made of Cu or an alloy containing Cu, and a metallic film formed on the lead frame body 21 and to connected to a metallic wire 15 connected to the electrode pad 36 of the semiconductor chip 12. The metallic film is an Ag-plated film 22 with nanoparticles 34 arranged in gaps 33 among Ag crystal grains 31.
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申请公布号 |
US2010127369(A1) |
申请公布日期 |
2010.05.27 |
申请号 |
US20090626030 |
申请日期 |
2009.11.25 |
申请人 |
SHINKO ELECTRIC INDUSTRIES CO., LTD. |
发明人 |
SEKI KAZUMITSU;KURE MUNEAKI;NOZAKI AKEMI |
分类号 |
H01L23/495;H01L21/50 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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