发明名称 SUBSTRATE SUPPORTING DEVICE AND PLASMA TREATMENT SYSTEM PROVIDED WITH THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a substrate supporting device arranged at the inside of a plasma treatment chamber and provided with a tubular structure at the lower side, where dew condensation at the inside of the tubular structure is effectively prevented without causing increase in the scale of the device constitution and complication of the device constitution. <P>SOLUTION: A substrate base 11 constituting a substrate supporting electrode and a supporting tube 14 supporting the substrate supporting electrode are mutually insulated by an insulation flange 15, and further, cooling water piping or the like connected to the lower face 111 of the substrate base 11 are held at the inside of the supporting tube 14 by an insulation collar 16. Further, the insulation collar part 16 is suitable for the hollow of the insulation flange. In this case, a lower face exposed space S formed by the lower face 111 of the substrate base 11, the inner circumferential face 152 of the insulation flange 15 and the outer circumferential face 161 of the insulation collar part 16 is water-tightly sealed with an O-ring 17 composed of a waterproof moisture-permeable material. Since the O-ring has moisture permeability, droplets D produced by the cooling can be volatilized as water vapor from the lower face exposed space S. <P>COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010116596(A) 申请公布日期 2010.05.27
申请号 JP20080290561 申请日期 2008.11.13
申请人 SHINMAYWA INDUSTRIES LTD 发明人 TERAKURA ATSUHIRO;IWASAKI YASUKUNI;AKASHI DAISUKE;MARUNAKA MASAO;MIYAZAKI NORIAKI;TSUCHIYA TAKAYUKI;NISHIDA ETSURO
分类号 C23C14/50;H01L21/205;H01L21/3065;H01L21/683;H05H1/46 主分类号 C23C14/50
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