| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a film adhesive with which even when a semiconductor package, in which a material of semiconductor members such as a wire and a circuit is, e.g. copper, is produced by a film-on-wire method, semiconductor elements can be bonded to each other while preventing the semiconductor members from being damaged, and which can prevent the semiconductor members from corroding. <P>SOLUTION: The film adhesive includes an adhesive composition containing a low chlorine content liquid epoxy resin (A) having total chlorine concentration of ≤250 ppm, a dicyclopentadiene type solid epoxy resin (B), an ion trapping agent (C), and a silica filler (D) having an average particle diameter of 3-20 μm, wherein the content ratio of the silica filler (D) in the adhesive composition is 50-70 mass% in terms of solid content. <P>COPYRIGHT: (C)2010,JPO&INPIT |
