发明名称 |
SIDE VIEW TYPE LIGHT-EMITTING DIODE PACKAGE STRUCTURE, AND MANUFACTURING METHOD AND APPLICATION THEREOF |
摘要 |
A side view type light-emitting diode package structure, and a manufacturing method and an application thereof are described. The side view type light-emitting diode package structure includes a silicon base, a first and a second conductive leads and at least one light-emitting diode chip. The silicon base includes a first cavity defining a light-extracting surface of the package structure. The first and the second conductive leads are respectively disposed at least on a portion and another portion of the first cavity and extend to an outer surface of the silicon base. The first and the second conductive leads are electrically isolated from each other. The light-emitting diode chip includes a first and second electrodes electrically connected to the first and the second conductive leads respectively, wherein the surface on the outer side of the silicon base is substantially perpendicular to the light-extracting surface.
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申请公布号 |
US2010127294(A1) |
申请公布日期 |
2010.05.27 |
申请号 |
US20090557524 |
申请日期 |
2009.09.11 |
申请人 |
CHI MEI LIGHTING TECHNOLOGY CORP. |
发明人 |
CHEN SHIMING;WANG HSINGMAO |
分类号 |
H01L33/00 |
主分类号 |
H01L33/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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