MANUFACTURING METHOD OF ELECTRONIC PARTS BUILT-IN SUBSTRATE,申请号KR20080058320-传众专利搜索

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发明名称	MANUFACTURING METHOD OF ELECTRONIC PARTS BUILT-IN SUBSTRATE
摘要
申请公布号	KR100959859(B1)	申请公布日期	2010.05.27
申请号	KR20080058320	申请日期	2008.06.20
申请人		发明人
分类号	H05K1/18;H05K3/30;H05K3/46	主分类号	H05K1/18
代理机构		代理人
主权项
地址

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