| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device from which a stiffening member does not come free even though there is a deterioration in adhesion caused by an attack of chemical solution, a decrease in stress, or the like. <P>SOLUTION: The semiconductor device includes: a wiring board 1; a semiconductor chip 4 mounted on the wiring board 1; the stiffening member 2 mounted on the wiring board 1 so as to surround the circumference of the semiconductor chip 4; and a fixing member 6 for sandwiching and fixing at least two mutually facing parts of the wiring board 1 and its stiffening member 2. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
