| 摘要 |
PROBLEM TO BE SOLVED: To suppress an increase in electrical connection-resistance value between an electronic component and a substrate via a conductive adhesive even if the conductive adhesive has a temperature exceeding a glass transition point in an electronic apparatus in which the substrate and the electronic component that are connected via the conductive adhesive are sealed by a mold resin via an adhesion contributing agent. SOLUTION: Each diameter of voids existing in an adhesion contributing agent 50 located around an electronic component 20 is set to ≤100,000 μm<SB>2</SB>or the film thickness of the adhesion contributing agent 50 located around the electronic component 20 is set to ≤20 μm. COPYRIGHT: (C)2010,JPO&INPIT
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