发明名称 Hot melt compositions
摘要 Hot melt compositions include acid waxes and acrylate functional monomers free of acid groups. Upon application of actinic radiation, the hot melt compositions cure to form and etch resist. The hot melt compositions may be used in the manufacture of printed circuit boards, optoelectronic and photovoltaic devices.
申请公布号 US2010129754(A1) 申请公布日期 2010.05.27
申请号 US20090590209 申请日期 2009.11.04
申请人 ROHM AND HAAS ELECTRONIC MATERIALS LLC 发明人 CHEETHAM KEVIN J.;SUTTER THOMAS C.
分类号 G03F7/20;G03F7/004 主分类号 G03F7/20
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