发明名称 |
MULTI-LAYER PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF |
摘要 |
A method of manufacturing a multi-layer PCB having external contact pads formed on one side can include: forming an outermost insulation layer, in which openings are formed corresponding with the external contact pads; forming a mask, in which openings are formed corresponding with the external contact pad and with a circuit pattern, on the outermost insulation layer; forming the external contact pads and the circuit pattern in the openings of the outermost insulation layer and the openings of the mask; removing the mask; forming a build-up layer by stacking layers over the outermost insulation layer such that the external contact pads and the circuit pattern are covered; forming a first solder resist layer on the build-up layer; and forming a second solder resist layer on an opposite side of the outermost insulation layer; and forming openings in the second solder resist layer such that the external contact pads are exposed.
|
申请公布号 |
US2010126765(A1) |
申请公布日期 |
2010.05.27 |
申请号 |
US20090569104 |
申请日期 |
2009.09.29 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
KIM KI-HWAN;AN JIN-YONG;LEE JAE-JOON |
分类号 |
H05K1/11;B32B38/00;B32B38/10;C23F1/00 |
主分类号 |
H05K1/11 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|