发明名称 |
DICING DIE-BONDING FILM AND PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE |
摘要 |
The present invention relates to a dicing die-bonding film including: a dicing film having a pressure-sensitive adhesive layer provided on a base material; and a die-bonding film provided on the pressure-sensitive adhesive layer. The pressure-sensitive adhesive layer of the dicing film is a heat-expandable pressure-sensitive adhesive layer formed of a heat-expandable pressure-sensitive adhesive containing an acrylic polymer A and a foaming agent. The acrylic polymer A is an acrylic polymer composed of a monomer composition containing 50% by weight or more of an acrylic acid ester represented by CH2═CHCOOR (wherein R is an alkyl group having 6 to 10 carbon atoms) and 1% by weight to 30% by weight of a hydroxyl group-containing monomer and containing no carboxyl group-containing monomer. The heat-expandable pressure-sensitive adhesive layer has a surface free energy of 30 mJ/m2 or less. The die-bonding film is constituted by a resin composition containing an epoxy resin.
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申请公布号 |
US2010129987(A1) |
申请公布日期 |
2010.05.27 |
申请号 |
US20090625682 |
申请日期 |
2009.11.25 |
申请人 |
NITTO DENKO CORPORATION |
发明人 |
KAMIYA KATSUHIKO;OOTAKE HIRONAO;MATSUMURA TAKESHI;MURATA SHUUHEI |
分类号 |
H01L21/78;B32B27/38 |
主分类号 |
H01L21/78 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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