发明名称 DEFECT REVIEW APPARATUS AND METHOD FOR WAFER
摘要 A defect review apparatus includes a storage device which stores data about a defect of an inspection target object; a first imaging device which captures an image located in a position on a surface of the inspection target object, the position being specified by information regarding the position of the inspection target object which has been input; and a control device which controls the first imaging device. The storage device stores: first defect detection data including a defect number as which the defect of the inspection target object detected by a first defect detection process is labeled, and information regarding the position of the defect; and second defect data including a defect number as which the defect of the inspection target object detected by a second defect detection process is labeled, and information regarding its position.
申请公布号 US2010128119(A1) 申请公布日期 2010.05.27
申请号 US20090614905 申请日期 2009.11.09
申请人 FUJITSU MICROELECTRONICS LIMITED 发明人 TAKAHASHI NAOHIRO
分类号 H04N7/18;G06K9/00 主分类号 H04N7/18
代理机构 代理人
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