发明名称 |
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD |
摘要 |
A processing solution supply nozzle is moved relatively from one end to the opposite end of a semiconductor wafer having undergone a developing operation while discharging an anti-static processing solution in a discharge width equal to or greater than the width of the semiconductor wafer. The anti-static processing solution is thereby supplied onto the semiconductor wafer. The prevention of charging of the substrate avoids the occurrence of defects. The processing solution supplied almost uniformly on the entire surface of the substrate also avoids the occurrence of defects.
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申请公布号 |
US2010126532(A1) |
申请公布日期 |
2010.05.27 |
申请号 |
US20100694759 |
申请日期 |
2010.01.27 |
申请人 |
DAINIPPON SCREEN MFG. CO., LTD |
发明人 |
TAMADA OSAMU;SANADA MASAKAZU |
分类号 |
B08B3/00;G03F7/30;B05C5/02;B05C11/08;B08B3/02;H01L21/00;H01L21/027 |
主分类号 |
B08B3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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