METHOD FOR MANUFACTURING A PRINTED CIRCUIT BOARD HAVING A LANDLESS VIA

摘要

PURPOSE: A manufacturing method of a printed circuit board having landless via is provided to offer a via without a land by forming a resist layer including an opening hole which matches with a via hole using resist coating apparatus. CONSTITUTION: A via hole is formed on an insulating layer(300). A metal seed layer(500) is formed on an upper insulating layer and an inner wall of the via hole. A plating resist layer(600) including an opening hole that matches with the via hole is formed on the top of the meal seed layer using a resist coating apparatus. An opening for forming a circuit pattern is patterned on the plating resist layer. A via(700) and a circuit pattern(900) are formed on the via hole and the opening. The plating resist layer is removed. The exposed portion of the metal seed layer is removed.