发明名称 SUBSTRATE TREATING APPARATUS AND METHOD FOR TREATING SUBSTRATE USING THE SAME
摘要 PURPOSE: A substrate processing apparatus and a substrate processing method using the same are provided to selectively process the substrate by partially controlling the temperature of the substrate. CONSTITUTION: A substrate is loaded on a plate(112). A processing supply unit supplies chemical to the substrate. The plate includes a temperature controller(132) which controls the temperature of the substrate. The temperature controller includes a plurality of regions which includes a heating unit or cooling unit.
申请公布号 KR20100055775(A) 申请公布日期 2010.05.27
申请号 KR20080114645 申请日期 2008.11.18
申请人 SEMES CO., LTD. 发明人 LEE, BOK KYU;CHOI, JONG SU
分类号 H01L21/306;H01L21/683;H01L21/687 主分类号 H01L21/306
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