| 摘要 |
PROBLEM TO BE SOLVED: To provide a protection tape peeling method capable of peeling off a protection tape from a semiconductor wafer without damaging the semiconductor wafer during the peeling. SOLUTION: In the protection tape peeling method for peeling off the protection tape stuck to the surface of the semiconductor wafer configured by forming a device area on which a plurality of devices are formed and an outer peripheral surplus area surrounding the device area on a surface, forming a circular recessed part on a rear face corresponding to the device area and forming a ring-like reinforcing part on the outer periphery of the circular recessed part, at least two points on the outer periphery of the semiconductor wafer are set as peeling start points and the protection tape is peeled off to the center of the semiconductor wafer. COPYRIGHT: (C)2010,JPO&INPIT |
