| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin encapsulated semiconductor device which is low-cost and advantageous also in terms of reliability. SOLUTION: A first lead frame 10 having a die pad 12 and a second lead frame 20 having inner leads 23a, 23b are prepared. A semiconductor chip 30 is mounted on the die pad 12, and the second lead frame 20 is superimposed on the first lead frame 10. The respective distal end parts 25a, 25b of the inner leads 23a, 23b and a part (electrode) of the semiconductor chip 30 are bonded by ultrasonic welding, etc. After that, a laminate of the first, second lead frame 10, 20 is set in a mold to perform resin encapsulation. Since the semiconductor chip 30 is directly connected to the inner leads 23a, 23b by one bonding part, reliability of bonding is high. Positioning between the semiconductor chip 30 and the inner leads 23a, 23b is simple and manufacturing costs are also inexpensive. COPYRIGHT: (C)2010,JPO&INPIT |
